Findchips: Compare MAX469C/D vs MAX469EWE

MAX469C/D vs MAX469EWE feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	MAXIM INTEGRATED PRODUCTS INC	MAXIM INTEGRATED PRODUCTS INC
Part Package Code	DIE	SOIC
Package Description	DIE,	0.300 INCH, SO-16
Reach Compliance Code	not_compliant	not_compliant
ECCN Code	EAR99	EAR99
HTS Code	8542.33.00.01	8542.39.00.01
Amplifier Type	BUFFER	BUFFER
Average Bias Current-Max (IIB)	5 µA	5 µA
Bandwidth (3dB)-Nom	90 MHz	90 MHz
Input Offset Voltage-Max	15000 µV	15000 µV
JESD-30 Code	X-XUUC-N	R-PDSO-G16
Moisture Sensitivity Level	1	1
Neg Supply Voltage Limit-Max	-6 V	-6 V
Neg Supply Voltage-Nom (Vsup)	-5 V	-5 V
Number of Functions	3	3
Operating Temperature-Max	70 °C	85 °C
Operating Temperature-Min		-40 °C
Output Current-Min	0.02 A	0.02 A
Package Body Material	UNSPECIFIED	PLASTIC/EPOXY
Package Code	DIE	SOP
Package Shape	UNSPECIFIED	RECTANGULAR
Package Style	UNCASED CHIP	SMALL OUTLINE
Qualification Status	Not Qualified	Not Qualified
Slew Rate-Nom	300 V/us	300 V/us
Supply Current-Max	100 mA	100 mA
Supply Voltage Limit-Max	6 V	6 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	BIPOLAR	BIPOLAR
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Form	NO LEAD	GULL WING
Terminal Position	UPPER	DUAL
Base Number Matches	1	1
Pin Count		16
Factory Lead Time		4 Weeks
Bias Current-Max (IIB) @25C		3 µA
JESD-609 Code		e0
Length		10.3 mm
Number of Terminals		16
Package Equivalence Code		SOP16,.4
Peak Reflow Temperature (Cel)		245
Seated Height-Max		2.65 mm
Terminal Finish		TIN LEAD
Terminal Pitch		1.27 mm
Width		7.5 mm
	Amplifier Circuits » Buffer Amplifiers	Amplifier Circuits » Buffer Amplifiers