MAX3783UCM-TD
vs
MAX3783UCM+D
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFP
|
48-TQFP_EP-7X7X1.0
|
| Package Description |
7 X 7 MM, 1 MM HEIGHT, MS-026ABC-HD, TQFP-48
|
7 X 7 MM, 1 MM HEIGHT, ROHS COMPLIANT, MS-026ABC-HD, TQFP-48
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
S-PQFP-G48
|
S-PQFP-G48
|
| JESD-609 Code |
e0
|
e3
|
| Length |
7 mm
|
7 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
HTFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
2
|
1
|
| Manufacturer Package Code |
|
48-TQFP_EP-7X7X1.0
|
| Date Of Intro |
|
2001-11-16
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MAX3783UCM-TD with alternatives
Compare MAX3783UCM+D with alternatives