MAX3740AETG+
vs
MAX3795ETG+
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Not Recommended
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
| Part Package Code |
QFN
|
24-LFCSP-4X4X0.75
|
| Package Description |
4 X 4 MM, 0.80 MM PITCH,ROHS COMPLIANT, TQFN-24
|
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
S-XQCC-N24
|
S-XQCC-N24
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC24,.16SQ,20
|
LCC24,.16SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max |
3.63 V
|
3.63 V
|
| Supply Voltage-Min |
2.97 V
|
2.97 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4 mm
|
4 mm
|
| Base Number Matches |
4
|
2
|
| Manufacturer Package Code |
|
24-LFCSP-4X4X0.75
|
| Date Of Intro |
|
2004-08-11
|
| Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare MAX3740AETG+ with alternatives
Compare MAX3795ETG+ with alternatives