MAX3580ETJ+
vs
TDA6500TT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFN
|
TSSOP
|
Package Description |
5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WHHD-2, TQFN-32
|
6.10 MM, 0.65 MM PITCH, PLASTIC, MO-153, SOT487-1, TSSOP-32
|
Pin Count |
32
|
32
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Built-in IF Amplifier |
YES
|
NO
|
Consumer IC Type |
VIDEO TUNER
|
VIDEO TUNER
|
Input Frequency-Max (RF) |
878 MHz
|
855.5 MHz
|
Input Frequency-Min (RF) |
470 MHz
|
44.5 MHz
|
JESD-30 Code |
S-XQCC-N32
|
R-PDSO-G32
|
JESD-609 Code |
e3
|
|
Length |
5 mm
|
11 mm
|
Moisture Sensitivity Level |
1
|
|
Noise Figure-Nom |
6.5 dB
|
8 dB
|
Number of Bands |
1
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
TSSOP
|
Package Equivalence Code |
LCC32,.2SQ,20
|
TSSOP32,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
1.1 mm
|
Supply Current-Max |
225 mA
|
122 mA
|
Supply Voltage-Max (Vsup) |
3.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3.1 V
|
4.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
5 mm
|
6.1 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MAX3580ETJ+ with alternatives
Compare TDA6500TT with alternatives