TDA6500TT
vs
SI2136
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
SILICON LABORATORIES INC
|
| Part Package Code |
TSSOP
|
QFN
|
| Package Description |
6.10 MM, 0.65 MM PITCH, PLASTIC, MO-153, SOT487-1, TSSOP-32
|
HVQCCN,
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in IF Amplifier |
NO
|
YES
|
| Consumer IC Type |
VIDEO TUNER
|
VIDEO TUNER
|
| Input Frequency-Max (RF) |
855.5 MHz
|
1002 MHz
|
| Input Frequency-Min (RF) |
44.5 MHz
|
42 MHz
|
| JESD-30 Code |
R-PDSO-G32
|
S-XQCC-N32
|
| Length |
11 mm
|
5 mm
|
| Noise Figure-Nom |
8 dB
|
4 dB
|
| Number of Bands |
3
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-20 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP32,.3
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
0.9 mm
|
| Supply Current-Max |
122 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
6.1 mm
|
5 mm
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
OPERATES AT 1.8V AND 3.3V SUPPLY
|
| Technology |
|
CMOS
|
|
|
|
Compare TDA6500TT with alternatives
Compare SI2136 with alternatives