MAX3272AEGP vs SY88309BLMGTR feature comparison

MAX3272AEGP Maxim Integrated Products

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SY88309BLMGTR Micrel Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC MICREL INC
Part Package Code QFN DFN
Package Description 4 X 4 MM, 0.90 MM HEIGHT, MO-220, QFN-20 HVQCCN, LCC16,.12SQ,20
Pin Count 20 16
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
HTS Code 8542.33.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Applications ATM; SDH; SONET SDH; SONET
JESD-30 Code S-XQCC-N20 S-XQCC-N16
JESD-609 Code e0 e4
Length 4 mm 3 mm
Moisture Sensitivity Level 1 2
Number of Functions 1 1
Number of Terminals 20 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code HVQCCN HVQCCN
Package Equivalence Code LCC20,.16SQ,20 LCC16,.12SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 0.95 mm
Supply Current-Max 0.044 mA 0.06 mA
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology BIPOLAR
Telecom IC Type ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 4 mm 3 mm
Base Number Matches 2 1
Pbfree Code Yes
Manufacturer Package Code MLF
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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Compare SY88309BLMGTR with alternatives