MAX3272AEGP
vs
SY88309BLMGTR
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MICREL INC
Part Package Code
QFN
DFN
Package Description
4 X 4 MM, 0.90 MM HEIGHT, MO-220, QFN-20
HVQCCN, LCC16,.12SQ,20
Pin Count
20
16
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8542.33.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Applications
ATM; SDH; SONET
SDH; SONET
JESD-30 Code
S-XQCC-N20
S-XQCC-N16
JESD-609 Code
e0
e4
Length
4 mm
3 mm
Moisture Sensitivity Level
1
2
Number of Functions
1
1
Number of Terminals
20
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC20,.16SQ,20
LCC16,.12SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
0.95 mm
Supply Current-Max
0.044 mA
0.06 mA
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BIPOLAR
Telecom IC Type
ATM/SONET/SDH SUPPORT CIRCUIT
ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
4 mm
3 mm
Base Number Matches
2
1
Pbfree Code
Yes
Manufacturer Package Code
MLF
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare MAX3272AEGP with alternatives
Compare SY88309BLMGTR with alternatives