MAX3209EEGL
vs
ADM2209EARU
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
QFN
|
TSSOP
|
Package Description |
VQCCN, LCC40,.24SQ,20
|
TSSOP-38
|
Pin Count |
40
|
38
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Differential Output |
NO
|
NO
|
Driver Number of Bits |
6
|
6
|
Input Characteristics |
SCHMITT TRIGGER
|
SCHMITT TRIGGER
|
Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
Interface Standard |
EIA-232
|
EIA-232-E; TIA-232-E; V.28
|
JESD-30 Code |
S-XQCC-N40
|
R-PDSO-G38
|
JESD-609 Code |
e0
|
e0
|
Length |
6 mm
|
9.7 mm
|
Number of Functions |
6
|
6
|
Number of Terminals |
40
|
38
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Out Swing-Min |
10 V
|
|
Output Low Current-Max |
0.0016 A
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VQCCN
|
TSSOP
|
Package Equivalence Code |
LCC40,.24SQ,20
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Receive Delay-Max |
1000 ns
|
2000 ns
|
Receiver Number of Bits |
10
|
10
|
Seated Height-Max |
0.85 mm
|
1.1 mm
|
Supply Current-Max |
1 mA
|
|
Supply Voltage-Max |
5.5 V
|
13.2 V
|
Supply Voltage-Min |
3 V
|
10.8 V
|
Supply Voltage-Nom |
3.3 V
|
12 V
|
Supply Voltage1-Max |
13.2 V
|
|
Supply Voltage1-Min |
10.8 V
|
|
Supply Voltage1-Nom |
12 V
|
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
6 mm
|
4.4 mm
|
Base Number Matches |
1
|
3
|
Additional Feature |
|
3 TO 5V STANDBY SUPPLY
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
240
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Transmit Delay-Max |
|
1500 ns
|
|
|
|
Compare MAX3209EEGL with alternatives
Compare ADM2209EARU with alternatives