MAX31740ATA+
vs
SA56004HDP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
PHILIPS SEMICONDUCTORS
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.31.00.01
Analog IC - Other Type
ANALOG CIRCUIT
JESD-30 Code
R-PDSO-N8
JESD-609 Code
e3
Length
3 mm
Moisture Sensitivity Level
1
Number of Channels
1
Number of Functions
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
HVSON
Package Equivalence Code
SOLCC8,.08,20
TSSOP8,.2
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Seated Height-Max
0.8 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
NO LEAD
Terminal Pitch
0.5 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
2 mm
Base Number Matches
2
1
Package Description
TSSOP8,.19
Accuracy-Max (Cel)
1 Cel
Body Breadth
3 mm
Body Height
0.875 mm
Body Length or Diameter
3 mm
Housing
PLASTIC
Mounting Feature
SURFACE MOUNT
Number of Bits
11
Output Interface Type
2-WIRE INTERFACE
Package Shape/Style
SQUARE
Sensors/Transducers Type
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Supply Voltage-Max
5.5 V
Supply Voltage-Min
3 V
Termination Type
SOLDER
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