MAX24305EXG2
vs
MAX24305EXG+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
CSBGA-81
|
10 X 10 MM, ROHS COMPLIANT, CSBGA-81
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
3.3 V NOMINAL ALSO AVAILABLE
|
|
| Applications |
SONET;SDH
|
|
| JESD-30 Code |
S-PBGA-B81
|
S-PBGA-B81
|
| JESD-609 Code |
e1
|
|
| Length |
10 mm
|
10 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
81
|
81
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA81,9X9,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Seated Height-Max |
1.47 mm
|
1.47 mm
|
| Supply Current-Max |
441 mA
|
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
1
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|