MAX20078ATE/V+
vs
TPS92515HVQDGQRQ1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TQFN-16
|
MSOP-10
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
|
| Date Of Intro |
2017-06-08
|
2016-05-05
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
S-XQCC-N16
|
S-PDSO-G10
|
| JESD-609 Code |
e3
|
e4
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Multiplexed Display Capability |
NO
|
NO
|
| Number of Functions |
1
|
1
|
| Number of Segments |
2
|
1
|
| Number of Terminals |
16
|
10
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HTSSOP
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
0.8 mm
|
1.1 mm
|
| Supply Voltage-Max |
65 V
|
65 V
|
| Supply Voltage-Min |
4.5 V
|
5.5 V
|
| Supply Voltage-Nom |
14 V
|
40 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Number of Channels |
|
1
|
| Temperature Grade |
|
AUTOMOTIVE
|
| fmax-Min |
|
2 MHz
|
|
|
|
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