MAX1760ETB+
vs
MAX1760ETB
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
DFN
|
SON
|
Package Description |
HVSON, SOLCC10,.12,20
|
3 X 3 MM, 0.80 MM HEIGHT, MO-229WEED-3, TDFN-10
|
Pin Count |
10
|
10
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
VOLTAGE-MODE
|
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
5.5 V
|
5.5 V
|
Input Voltage-Nom |
.7 V
|
.7 V
|
JESD-30 Code |
S-PDSO-N10
|
S-PDSO-N10
|
JESD-609 Code |
e3
|
e0
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
10
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
1.6 A
|
1.5 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC10,.12,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BOOST
|
BOOST
|
Switching Frequency-Max |
1200 kHz
|
1200 kHz
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
Additional Feature |
|
IT CAN ALSO OPERATE WITH PULSE FREQUENCY MODULATION
|
|
|
|
Compare MAX1760ETB+ with alternatives
Compare MAX1760ETB with alternatives