MAX14839GWC+
vs
MAX14839GTC+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
VFBGA,
|
HVSON,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
JESD-30 Code |
R-PBGA-B12
|
S-PDSO-N12
|
JESD-609 Code |
e1
|
e3
|
Length |
2.215 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
12
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HVSON
|
Package Equivalence Code |
BGA12,3X4,20
|
SOLCC12,.12,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.69 mm
|
0.8 mm
|
Supply Voltage-Max |
34 V
|
34 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
24 V
|
24 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.885 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MAX14839GWC+ with alternatives
Compare MAX14839GTC+ with alternatives