MAS17501CB
vs
L29C101PC35
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GEC PLESSEY SEMICONDUCTORS
LOGIC DEVICES INC
Package Description
,
0.900 INCH, PLASTIC, DIP-64
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
External Data Bus Width
16
16
JESD-30 Code
R-CDIP-T64
R-PDIP-T64
Number of Terminals
64
64
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
35 mA
30 mA
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
BIT-SLICE MICROPROCESSOR
BIT-SLICE MICROPROCESSOR
Base Number Matches
1
1
Rohs Code
Part Package Code
DIP
Pin Count
64
Additional Feature
9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ
Clock Frequency-Max
30 MHz
JESD-609 Code
e0
Length
81.28 mm
Moisture Sensitivity Level
3
Package Equivalence Code
DIP64,.9
Peak Reflow Temperature (Cel)
225
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
22.86 mm
Compare MAS17501CB with alternatives
Compare L29C101PC35 with alternatives