L29C101PC35
vs
MAQ17502CE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LOGIC DEVICES INC
GEC PLESSEY SEMICONDUCTORS
Part Package Code
DIP
Package Description
0.900 INCH, PLASTIC, DIP-64
,
Pin Count
64
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
9 BIT INSTRUCTION DECODER; ICC SPECIFIED @ 5MHZ
Clock Frequency-Max
30 MHz
External Data Bus Width
16
16
JESD-30 Code
R-PDIP-T64
R-CDIP-T64
JESD-609 Code
e0
Length
81.28 mm
Moisture Sensitivity Level
3
Number of Terminals
64
64
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP64,.9
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Current-Max
30 mA
35 mA
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
22.86 mm
uPs/uCs/Peripheral ICs Type
BIT-SLICE MICROPROCESSOR
BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Base Number Matches
1
1
Compare L29C101PC35 with alternatives
Compare MAQ17502CE with alternatives