MAR2911CC vs AM2911ADCB feature comparison

MAR2911CC Dynex Semiconductor

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AM2911ADCB AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GEC PLESSEY SEMICONDUCTORS ADVANCED MICRO DEVICES INC
Package Description , DIP, DIP20,.3
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
External Data Bus Width 4 4
JESD-30 Code R-CDIP-T28 R-GDIP-T28
Number of Terminals 28 28
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 5 mA 130 mA
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Base Number Matches 1 1
Rohs Code No
Part Package Code DIP
Pin Count 28
JESD-609 Code e0
Length 37.211 mm
Package Code DIP
Package Equivalence Code DIP20,.3
Seated Height-Max 5.715 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

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