MAL5114CC
vs
5962-8751307VA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Active
Ihs Manufacturer
DYNEX SEMICONDUCTOR LTD
TELEDYNE E2V (UK) LTD
Package Description
,
DIP, DIP18,.3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
3
3
Part Package Code
DIP
Pin Count
18
Access Time-Max
25 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T18
JESD-609 Code
e0
Memory Density
4096 bit
Memory IC Type
STANDARD SRAM
Memory Width
4
Number of Functions
1
Number of Terminals
18
Number of Words
1024 words
Number of Words Code
1000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
1KX4
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP18,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Qualified
Screening Level
MIL-STD-883
Standby Current-Max
0.01 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.11 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Compare MAL5114CC with alternatives
Compare 5962-8751307VA with alternatives