M93C66-WMB3T/W
vs
93LC66CX-E/STG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
TSSOP
Package Description
2 X 3 MM, MLP-8
TSSOP,
Pin Count
8
8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Alternate Memory Width
8
8
Clock Frequency-Max (fCLK)
2 MHz
3 MHz
Data Retention Time-Min
40
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-XDSO-N8
R-PDSO-G8
JESD-609 Code
e0
e3
Length
3 mm
4.4 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256X16
256X16
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VSON
TSSOP
Package Equivalence Code
SOLCC8,.11,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.6 mm
1.1 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Standby Current-Max
0.000005 A
Supply Current-Max
0.002 mA
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
2 mm
3 mm
Write Cycle Time-Max (tWC)
5 ms
6 ms
Write Protection
SOFTWARE
Base Number Matches
1
1
Pbfree Code
Additional Feature
ALSO CONFIGURABLE AS 512 X 8
Moisture Sensitivity Level
1
Screening Level
AEC-Q100
Compare M93C66-WMB3T/W with alternatives
Compare 93LC66CX-E/STG with alternatives