M7A3PE1500-2FGG676I vs A3PE1500-FGG676 feature comparison

M7A3PE1500-2FGG676I Microsemi Corporation

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A3PE1500-FGG676 Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, BGA676,26X26,40 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 1500000 1500000
Number of Inputs 444 444
Number of Logic Cells 38400 38400
Number of Outputs 444 444
Number of Terminals 676 676
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1500000 GATES 38400 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 1 6
Factory Lead Time 8 Weeks
Clock Frequency-Max 350 MHz
Number of CLBs 38400
Packing Method TRAY
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

Compare M7A3PE1500-2FGG676I with alternatives

Compare A3PE1500-FGG676 with alternatives