A3PE1500-FGG676
vs
A3PE1500-2FG676I
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ACTEL CORP
|
| Package Description |
27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676
|
27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
8 Weeks
|
|
| Clock Frequency-Max |
350 MHz
|
350 MHz
|
| JESD-30 Code |
S-PBGA-B676
|
S-PBGA-B676
|
| JESD-609 Code |
e1
|
e0
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
38400
|
38400
|
| Number of Equivalent Gates |
1500000
|
1500000
|
| Number of Inputs |
444
|
444
|
| Number of Logic Cells |
38400
|
38400
|
| Number of Outputs |
444
|
444
|
| Number of Terminals |
676
|
676
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
38400 CLBS, 1500000 GATES
|
38400 CLBS, 1500000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA676,26X26,40
|
BGA676,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Packing Method |
TRAY
|
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.44 mm
|
2.44 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare A3PE1500-FGG676 with alternatives