M74HCT138M1R vs TC74HCT138AFN(ELP) feature comparison

M74HCT138M1R STMicroelectronics

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TC74HCT138AFN(ELP) Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete Lifetime Buy
Ihs Manufacturer STMICROELECTRONICS TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.25 SOP,
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Additional Feature 3 ENABLE INPUTS 3 ENABLE INPUTS
Family HCT HCT
Input Conditioning STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER OTHER DECODER/DRIVER
Max I(ol) 0.004 A
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TUBE
Prop. Delay@Nom-Sup 45 ns
Propagation Delay (tpd) 45 ns 44 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code No
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare TC74HCT138AFN(ELP) with alternatives