M74HC85F1
vs
8601301EX
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
HARRIS SEMICONDUCTOR
Part Package Code
DIP
DIP
Package Description
DIP, DIP16,.3
DIP,
Pin Count
16
16
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CASCADABLE
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Logic IC Type
MAGNITUDE COMPARATOR
MAGNITUDE COMPARATOR
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
58 ns
295 ns
Qualification Status
Not Qualified
Seated Height-Max
5 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
2
5
Screening Level
MIL-STD-883
Compare M74HC85F1 with alternatives
Compare 8601301EX with alternatives