M5M5V108DVP-70H vs HY62U8100BLLT1-70 feature comparison

M5M5V108DVP-70H Renesas Electronics Corporation

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HY62U8100BLLT1-70 SK Hynix Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP SK HYNIX INC
Part Package Code TSOP TSOP1
Package Description 8 X 20 MM, TSOP-32 TSOP1, TSSOP32,.8,20
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e2 e6
Length 18.4 mm 18.4 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 2
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Equivalence Code TSSOP32,.8,20 TSSOP32,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.000001 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.035 mA 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Copper (Sn/Cu) TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 8 mm 8 mm
Base Number Matches 2 3

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Compare HY62U8100BLLT1-70 with alternatives