M5M5256DFP-55XL-I vs K6X0808C1D-GF55 feature comparison

M5M5256DFP-55XL-I Mitsubishi Electric

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K6X0808C1D-GF55 Samsung Semiconductor

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Pbfree Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MITSUBISHI ELECTRIC CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code SOIC SOIC
Package Description SOP, 0.450 INCH, SOP-28
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-PDSO-G28 R-PDSO-G28
Length 17.5 mm 18.29 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 3 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8.4 mm 8.38 mm
Base Number Matches 1 3
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Package Equivalence Code SOP28,.45
Standby Current-Max 0.00001 A
Standby Voltage-Min 2 V
Supply Current-Max 0.025 mA
Terminal Finish TIN LEAD

Compare M5M5256DFP-55XL-I with alternatives

Compare K6X0808C1D-GF55 with alternatives