M5M51008DFP-55HI
vs
EDI88130CS55L32B
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
MICROSEMI CORP
|
| Part Package Code |
SOIC
|
QFJ
|
| Package Description |
0.525 INCH, SOP-32
|
QCCN,
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
55 ns
|
55 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PDSO-G32
|
R-CQCC-N32
|
| Length |
20.75 mm
|
13.97 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
128KX8
|
128KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
QCCN
|
| Package Equivalence Code |
SOP32,.56
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.05 mm
|
3.048 mm
|
| Standby Voltage-Min |
2 V
|
|
| Supply Current-Max |
0.085 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
11.4 mm
|
11.43 mm
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Screening Level |
|
MIL-STD-883
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare M5M51008DFP-55HI with alternatives
Compare EDI88130CS55L32B with alternatives