M5M51008DFP-55HI vs EDI88130CS45CC feature comparison

M5M51008DFP-55HI Renesas Electronics Corporation

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EDI88130CS45CC Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer RENESAS TECHNOLOGY CORP MICROSEMI CORP
Part Package Code SOIC DIP
Package Description 0.525 INCH, SOP-32 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 45 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32 R-CDIP-T32
Length 20.75 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 2
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DIP
Package Equivalence Code SOP32,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 245 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.05 mm
Standby Voltage-Min 2 V
Supply Current-Max 0.085 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 11.4 mm 10.16 mm
Base Number Matches 3 1

Compare M5M51008DFP-55HI with alternatives

Compare EDI88130CS45CC with alternatives