XCR3256XL-12FTG256I
vs
XCR3256XL-12PQ208I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
QFP
Package Description
FBGA-256
PLASTIC, QFP-208
Pin Count
256
208
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
12 Weeks
Additional Feature
YES
YES
Clock Frequency-Max
88 MHz
88 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B256
S-PQFP-G208
JESD-609 Code
e1
e4
JTAG BST
YES
YES
Length
17 mm
28 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
164
164
Number of Macro Cells
256
256
Number of Terminals
256
208
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
0 DEDICATED INPUTS, 164 I/O
0 DEDICATED INPUTS, 164 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
FQFP
Package Equivalence Code
BGA256,16X16,40
QFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
12 ns
12 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.55 mm
4.1 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2.7 V
2.7 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
NICKEL PALLADIUM GOLD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
17 mm
28 mm
Base Number Matches
2
1
Number of Inputs
164
Number of Outputs
164
Compare XCR3256XL-12FTG256I with alternatives
Compare XCR3256XL-12PQ208I with alternatives