M58WR032EB100ZB6
vs
S29PL032J70BFI150
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
STMICROELECTRONICS
|
SPANSION INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56
|
7 X 9 MM, LEAD FREE, FBGA-56
|
Pin Count |
56
|
56
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
100 ns
|
70 ns
|
Boot Block |
BOTTOM
|
BOTTOM/TOP
|
Command User Interface |
YES
|
YES
|
Common Flash Interface |
YES
|
YES
|
Data Polling |
NO
|
YES
|
JESD-30 Code |
R-PBGA-B56
|
R-PBGA-B56
|
JESD-609 Code |
e0
|
e1
|
Length |
9 mm
|
9 mm
|
Memory Density |
33554432 bit
|
33554432 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
8,63
|
16,62
|
Number of Terminals |
56
|
56
|
Number of Words |
2097152 words
|
2097152 words
|
Number of Words Code |
2000000
|
2000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
2MX16
|
2MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA56,7X8,30
|
BGA56,8X8,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Page Size |
4 words
|
8 words
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
1.8 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Sector Size |
4K,32K
|
4K,32K
|
Standby Current-Max |
0.000005 A
|
0.000005 A
|
Supply Current-Max |
0.03 mA
|
0.07 mA
|
Supply Voltage-Max (Vsup) |
2.2 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.75 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Toggle Bit |
NO
|
YES
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
7.7 mm
|
7 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Additional Feature |
|
TOP AND BOTTOM BOOT BLOCK
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Ready/Busy |
|
YES
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare M58WR032EB100ZB6 with alternatives
Compare S29PL032J70BFI150 with alternatives