M58MR032C100ZC6
vs
M59DR032EA85ZB1T
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NUMONYX
|
NUMONYX
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
0.50 MM PITCH, TFBGA-48
|
LFBGA,
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
20 ns
|
85 ns
|
| JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
| Length |
10.53 mm
|
12 mm
|
| Memory Density |
33554432 bit
|
33554432 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
2MX16
|
2MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
LFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
1.8 V
|
1.8 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.35 mm
|
| Supply Voltage-Max (Vsup) |
2 V
|
2.2 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.75 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
6.29 mm
|
7 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Boot Block |
|
TOP
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
| Type |
|
NOR TYPE
|
|
|
|
Compare M58MR032C100ZC6 with alternatives
Compare M59DR032EA85ZB1T with alternatives