M59DR032EA85ZB1T
vs
M59DR032EA85ZB1E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NUMONYX
NUMONYX
Part Package Code
BGA
BGA
Package Description
LFBGA,
7 X 12 MM, 0.75 MM PITCH, TFBGA-48
Pin Count
48
48
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
85 ns
85 ns
Boot Block
TOP
TOP
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e1
Length
12 mm
12 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.35 mm
1.35 mm
Supply Voltage-Max (Vsup)
2.2 V
2.2 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
7 mm
7 mm
Base Number Matches
2
2
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare M59DR032EA85ZB1T with alternatives
Compare M59DR032EA85ZB1E with alternatives