M58MR016D100ZC6T
vs
SST39VF1682-70-4C-B3KE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NUMONYX
SILICON STORAGE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
0.50 MM PITCH, TFBGA-48
6 X 8 MM, 0.80 MM PITCH, MO-210AB-1, TFBGA-48
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
20 ns
70 ns
Boot Block
BOTTOM
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
10.53 mm
8 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
2097152 words
Number of Words Code
1000000
2000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1MX16
2MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
2 V
3.6 V
Supply Voltage-Min (Vsup)
1.7 V
2.7 V
Supply Voltage-Nom (Vsup)
1.8 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
Width
6.29 mm
6 mm
Base Number Matches
2
2
Rohs Code
JESD-609 Code
e1
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
40
Compare M58MR016D100ZC6T with alternatives
Compare SST39VF1682-70-4C-B3KE with alternatives