SST39VF1682-70-4C-B3KE vs SST39VF1681-70-4C-B3K feature comparison

SST39VF1682-70-4C-B3KE Silicon Storage Technology

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SST39VF1681-70-4C-B3K Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer SILICON STORAGE TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code BGA BGA
Package Description 6 X 8 MM, 0.80 MM PITCH, MO-210AB-1, TFBGA-48 6 X 8 MM, 0.80 MM PITCH, MO-210AB-1, TFBGA-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1 e3
Length 8 mm 8 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) MATTE TIN
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 6 mm 6 mm
Base Number Matches 2 2
Pbfree Code Yes
Additional Feature BOTTOM BOOT BLOCK
Boot Block BOTTOM
Type NOR TYPE

Compare SST39VF1682-70-4C-B3KE with alternatives

Compare SST39VF1681-70-4C-B3K with alternatives