M55342M03C750DS vs M55342M03U750DR-W feature comparison

M55342M03C750DS Mini-Systems Inc (MSI)

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M55342M03U750DR-W State of the Art Inc

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Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer MINI-SYSTEMS INC STATE OF THE ART INC
Reach Compliance Code compliant compliant
ECCN Code EAR99
Additional Feature PRECISION
Construction Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -55 °C -65 °C
Package Height 0.457 mm 0.46 mm
Package Length 2.667 mm 2.54 mm
Package Style SMT SMT
Package Width 1.27 mm 1.22 mm
Packing Method Tray WAFFLE PACK
Rated Power Dissipation (P) 0.2 W 0.2 W
Rated Temperature 70 °C 70 °C
Reference Standard MIL-PRF-55342 MIL-PRF-55342
Resistance 750 Ω 750 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1005 1005
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 300 ppm/°C 300 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 75 V 75 V
Base Number Matches 2 1
Package Description CHIP
JESD-609 Code e4
Package Shape RECTANGULAR PACKAGE
Terminal Finish Gold (Au)

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