M55342M03U750DR-W
vs
M55342M03G750DS
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
MINI-SYSTEMS INC
Package Description
CHIP
Reach Compliance Code
compliant
compliant
JESD-609 Code
e4
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-55 °C
Package Height
0.46 mm
0.457 mm
Package Length
2.54 mm
2.667 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.22 mm
1.27 mm
Packing Method
WAFFLE PACK
Tray
Rated Power Dissipation (P)
0.2 W
0.2 W
Rated Temperature
70 °C
70 °C
Reference Standard
MIL-PRF-55342
MIL-PRF-55342
Resistance
750 Ω
750 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1005
1005
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
300 ppm/°C
300 ppm/°C
Terminal Finish
Gold (Au)
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
75 V
75 V
Base Number Matches
1
2
ECCN Code
EAR99
Additional Feature
PRECISION
Construction
Chip
Compare M55342M03U750DR-W with alternatives
Compare M55342M03G750DS with alternatives