M54HC4050D1 vs 5962-8682001EX feature comparison

M54HC4050D1 STMicroelectronics

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5962-8682001EX Motorola Semiconductor Products

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS MOTOROLA INC
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP,
Pin Count 16
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T16 R-GDIP-T16
JESD-609 Code e0
Length 20.32 mm 19.56 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.004 A
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 23 ns
Propagation Delay (tpd) 150 ns 130 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 3.83 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 50k Rad(Si) V
Width 7.62 mm 7.62 mm
Base Number Matches 1 5
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 5962-8682001EX with alternatives