5962-8682001EX
vs
M54HC4050F1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
STMICROELECTRONICS
Package Description
DIP,
DIP, DIP16,.3
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T16
R-CDIP-T16
Length
19.56 mm
Logic IC Type
BUFFER
BUFFER
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
130 ns
100 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Base Number Matches
5
2
Rohs Code
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.006 A
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
26 ns
Schmitt Trigger
NO
Terminal Finish
TIN LEAD
Compare 5962-8682001EX with alternatives
Compare M54HC4050F1 with alternatives