M54HC32F1
vs
74AC32D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
AC
JESD-30 Code
R-GDIP-T14
R-PDSO-G14
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OR GATE
OR GATE
Max I(ol)
0.004 A
0.024 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Prop. Delay@Nom-Sup
27 ns
Propagation Delay (tpd)
27 ns
6 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
5 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Base Number Matches
2
8
Length
8.65 mm
Power Supply Current-Max (ICC)
0.04 mA
Compare M54HC32F1 with alternatives
Compare 74AC32D with alternatives