M53640810CW0-C50
vs
HB56D836SBR-6AC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
HITACHI LTD
Part Package Code
SIMM
SIMM
Package Description
,
,
Pin Count
72
72
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FAST PAGE WITH EDO
FAST PAGE
Access Time-Max
50 ns
60 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
RAS ONLY/CAS BEFORE RAS REFRESH
JESD-30 Code
R-XSMA-N72
R-XSMA-N72
Memory Density
301989888 bit
301989888 bit
Memory IC Type
EDO DRAM MODULE
FAST PAGE DRAM MODULE
Memory Width
36
36
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
72
72
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX36
8MX36
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
SIMM
SIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
SINGLE
SINGLE
Base Number Matches
1
1
Alternate Memory Width
18
Output Characteristics
3-STATE
Refresh Cycles
2048
Compare M53640810CW0-C50 with alternatives
Compare HB56D836SBR-6AC with alternatives