M52D16161A-10BG
vs
IS42S16100C1-7BLI
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
|
INTEGRATED SILICON SOLUTION INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
VFBGA,
|
TFBGA, BGA60,7X15,25
|
| Pin Count |
60
|
60
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.02
|
| Access Mode |
DUAL BANK PAGE BURST
|
DUAL BANK PAGE BURST
|
| Access Time-Max |
9 ns
|
5.5 ns
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| JESD-30 Code |
R-PBGA-B60
|
R-PBGA-B60
|
| Length |
10.1 mm
|
10.1 mm
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
60
|
60
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
1MX16
|
1MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Self Refresh |
YES
|
YES
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
6.4 mm
|
6.4 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Integrated Silicon Solution Inc.
|
| Clock Frequency-Max (fCLK) |
|
143 MHz
|
| I/O Type |
|
COMMON
|
| Interleaved Burst Length |
|
1,2,4,8
|
| JESD-609 Code |
|
e1
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
BGA60,7X15,25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Refresh Cycles |
|
4096
|
| Sequential Burst Length |
|
1,2,4,8,FP
|
| Standby Current-Max |
|
0.003 A
|
| Supply Current-Max |
|
0.14 mA
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare M52D16161A-10BG with alternatives
Compare IS42S16100C1-7BLI with alternatives