M52D16161A-10BG vs HY5V16EF6-H feature comparison

M52D16161A-10BG Elite Semiconductor Memory Technology Inc

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HY5V16EF6-H SK Hynix Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC SK HYNIX INC
Part Package Code BGA BGA
Package Description VFBGA, TFBGA,
Pin Count 60 60
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Access Time-Max 9 ns 5.5 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60 R-PBGA-B60
Length 10.1 mm 10 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.1 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.9 V 3.6 V
Supply Voltage-Min (Vsup) 1.7 V 3 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Width 6.4 mm 6.4 mm
Base Number Matches 1 1
Rohs Code No
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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