M4A3-384/192-65FANC vs XCR3384XL-10FT256C feature comparison

M4A3-384/192-65FANC Lattice Semiconductor Corporation

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XCR3384XL-10FT256C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP XILINX INC
Part Package Code BGA BGA
Package Description LEAD FREE, FPBGA-256 FBGA-256
Pin Count 256 256
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
Architecture PAL-TYPE
Clock Frequency-Max 95.2 MHz 102 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
JTAG BST YES YES
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 192 212
Number of Macro Cells 384 384
Number of Terminals 256 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 192 I/O 0 DEDICATED INPUTS, 212 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 6.5 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 1.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 17 mm 17 mm
Base Number Matches 1 1

Compare M4A3-384/192-65FANC with alternatives

Compare XCR3384XL-10FT256C with alternatives