XCR3384XL-10FT256C vs M4A3-384/192-12FANC feature comparison

XCR3384XL-10FT256C AMD

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M4A3-384/192-12FANC Lattice Semiconductor Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC LATTICE SEMICONDUCTOR CORP
Package Description FBGA-256 LEAD FREE, FPBGA-256
Reach Compliance Code not_compliant compliant
Additional Feature YES YES
Clock Frequency-Max 102 MHz 52.6 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
JTAG BST YES YES
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 212 192
Number of Inputs 212
Number of Macro Cells 384 384
Number of Outputs 212
Number of Terminals 256 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 212 I/O 0 DEDICATED INPUTS, 192 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type EE PLD EE PLD
Propagation Delay 10 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 2.1 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 17 mm 17 mm
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code BGA
Pin Count 256
ECCN Code EAR99
HTS Code 8542.39.00.01
Architecture PAL-TYPE

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