M4A3-256/128-65FAC
vs
M4A3-256/128-6YC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
VANTIS CORP
LATTICE SEMICONDUCTOR CORP
Reach Compliance Code
unknown
compliant
Clock Frequency-Max
118 MHz
95.2 MHz
JESD-30 Code
R-PBGA-B200
S-PQFP-G208
Number of Dedicated Inputs
Number of I/O Lines
128
128
Number of Terminals
200
208
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 128 I/O
0 DEDICATED INPUTS, 128 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
FQFP
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY
FLATPACK, FINE PITCH
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
6.5 ns
6 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
GULL WING
Terminal Position
BOTTOM
QUAD
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
QFP
Package Description
PLASTIC, QFP-208
Pin Count
208
HTS Code
8542.39.00.01
Additional Feature
YES
In-System Programmable
YES
JESD-609 Code
e0
JTAG BST
YES
Length
28 mm
Moisture Sensitivity Level
3
Number of Macro Cells
256
Package Equivalence Code
QFP208,1.2SQ,20
Peak Reflow Temperature (Cel)
225
Seated Height-Max
4.1 mm
Terminal Finish
TIN LEAD
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
28 mm
Compare M4A3-256/128-65FAC with alternatives
Compare M4A3-256/128-6YC with alternatives