M4A3-256/128-55YC vs XCR3256XL-10FTG256C feature comparison

M4A3-256/128-55YC Vantis Corporation

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XCR3256XL-10FTG256C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer VANTIS CORP XILINX INC
Reach Compliance Code unknown compliant
Additional Feature 256 MACROCELLS; 4 EXTERNAL CLOCKS; PROGRAMMABLE POLARITY YES
Clock Frequency-Max 105 MHz 105 MHz
In-System Programmable YES YES
JESD-30 Code S-PQFP-G208 S-PBGA-B256
JESD-609 Code e0 e1
JTAG BST YES YES
Number of Dedicated Inputs 14
Number of I/O Lines 128 164
Number of Macro Cells 256 256
Number of Terminals 208 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 14 DEDICATED INPUTS, 128 I/O 0 DEDICATED INPUTS, 164 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LBGA
Package Equivalence Code QFP208,1.2SQ,20 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style FLATPACK GRID ARRAY, LOW PROFILE
Programmable Logic Type EE PLD EE PLD
Propagation Delay 5.5 ns 10 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Package Description FBGA-256
Pin Count 256
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 12 Weeks
Length 17 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.55 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm

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Compare XCR3256XL-10FTG256C with alternatives