M4A3-256/128-14YI
vs
XCR3256XL-12FTG256I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
VANTIS CORP
ADVANCED MICRO DEVICES INC
Reach Compliance Code
unknown
compliant
Additional Feature
256 MACROCELLS; 4 EXTERNAL CLOCKS; PROGRAMMABLE POLARITY
YES
Clock Frequency-Max
41.7 MHz
88 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PQFP-G208
S-PBGA-B256
JESD-609 Code
e0
e1
JTAG BST
YES
YES
Number of Dedicated Inputs
14
Number of I/O Lines
128
164
Number of Macro Cells
256
256
Number of Terminals
208
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
14 DEDICATED INPUTS, 128 I/O
0 DEDICATED INPUTS, 164 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LBGA
Package Equivalence Code
QFP208,1.2SQ,20
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
GRID ARRAY, LOW PROFILE
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
14 ns
12 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
2.7 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Base Number Matches
2
2
Package Description
FBGA-256
Samacsys Manufacturer
AMD
Length
17 mm
Moisture Sensitivity Level
3
Number of Inputs
164
Number of Outputs
164
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.55 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
17 mm
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