M466S0823CT2-L10 vs M466F0804BT1-L60 feature comparison

M466S0823CT2-L10 Samsung Semiconductor

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M466F0804BT1-L60 Samsung Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Part Package Code MODULE MODULE
Package Description DIMM, DIMM144,32 DIMM, DIMM144,32
Pin Count 144 144
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode FOUR BANK PAGE BURST FAST PAGE WITH EDO
Access Time-Max 7 ns 60 ns
Additional Feature AUTO/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH
Clock Frequency-Max (fCLK) 100 MHz
I/O Type COMMON COMMON
JESD-30 Code R-XDMA-N144 R-XDMA-N144
Memory Density 536870912 bit 536870912 bit
Memory IC Type SYNCHRONOUS DRAM MODULE EDO DRAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8MX64 8MX64
Output Characteristics 3-STATE 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Equivalence Code DIMM144,32 DIMM144,32
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 4096 4096
Seated Height-Max 29.21 mm
Self Refresh YES YES
Standby Current-Max 0.008 A 0.0024 A
Supply Current-Max 0.88 mA 0.448 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1

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