M466F0804BT1-L60
vs
STI648104G2-60VGB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SIMPLE TECH INC
Part Package Code
MODULE
Package Description
DIMM, DIMM144,32
DIMM-144
Pin Count
144
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.28
Access Mode
FAST PAGE WITH EDO
FAST PAGE WITH EDO
Access Time-Max
60 ns
60 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type
COMMON
JESD-30 Code
R-XDMA-N144
R-XDMA-N144
Memory Density
536870912 bit
536870912 bit
Memory IC Type
EDO DRAM MODULE
EDO DRAM MODULE
Memory Width
64
64
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX64
8MX64
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Equivalence Code
DIMM144,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
4096
Self Refresh
YES
Standby Current-Max
0.0024 A
Supply Current-Max
0.448 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.8 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Alternate Memory Width
32
Compare M466F0804BT1-L60 with alternatives
Compare STI648104G2-60VGB with alternatives