M463S1724DN1-L7C
vs
HYM71V16M655ALT6-P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SK HYNIX INC
Part Package Code
MODULE
MODULE
Package Description
DIMM, DIMM144,20
DIMM, DIMM144,32
Pin Count
144
144
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
DUAL BANK PAGE BURST
DUAL BANK PAGE BURST
Access Time-Max
5.4 ns
6 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
133 MHz
100 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDMA-N144
R-XDMA-N144
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
SYNCHRONOUS DRAM MODULE
Memory Width
64
64
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16MX64
16MX64
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Equivalence Code
DIMM144,20
DIMM144,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
4096
Self Refresh
YES
YES
Standby Current-Max
0.016 A
0.016 A
Supply Current-Max
1 mA
1.6 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
JESD-609 Code
e4
Peak Reflow Temperature (Cel)
260
Terminal Finish
Gold (Au)
Time@Peak Reflow Temperature-Max (s)
20
Compare M463S1724DN1-L7C with alternatives
Compare HYM71V16M655ALT6-P with alternatives