M38510/33003BCX vs 54F10DM feature comparison

M38510/33003BCX Motorola Semiconductor Products

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54F10DM National Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 7 ns 7 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Length 19.939 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.02 A
Output Characteristics 3-STATE
Package Equivalence Code DIP14,.3
Power Supply Current-Max (ICC) 7.7 mA
Prop. Delay@Nom-Sup 7 ns
Schmitt Trigger NO
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/33003BCX with alternatives

Compare 54F10DM with alternatives