M38510/33003BCX
vs
MC54F10JD
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
F/FAST
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
3
3
Number of Inputs
3
3
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
7 ns
6.5 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
7
2
Length
19.495 mm
Load Capacitance (CL)
50 pF
Power Supply Current-Max (ICC)
7.7 mA
Seated Height-Max
5.08 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare M38510/33003BCX with alternatives
Compare MC54F10JD with alternatives