M38510/32102B2A
vs
HD74LS266FP-EL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
LANSDALE SEMICONDUCTOR INC
RENESAS TECHNOLOGY CORP
Part Package Code
QLCC
SOIC
Package Description
QCCN, LCC20,.35SQ
SOP,
Pin Count
20
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Family
LS
LS
JESD-30 Code
S-CQCC-N20
R-PDSO-G14
JESD-609 Code
e0
Logic IC Type
NAND GATE
XNOR GATE
Max I(ol)
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
20
14
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
-20 °C
Output Characteristics
OPEN-COLLECTOR
OPEN-COLLECTOR
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QCCN
SOP
Package Equivalence Code
LCC20,.35SQ
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE
Power Supply Current-Max (ICC)
4.4 mA
Prop. Delay@Nom-Sup
52 ns
Propagation Delay (tpd)
52 ns
30 ns
Qualification Status
Qualified
Not Qualified
Schmitt Trigger
NO
Screening Level
MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
DUAL
Base Number Matches
4
2
Rohs Code
Length
10.06 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Seated Height-Max
2.2 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5.5 mm
Compare M38510/32102B2A with alternatives
Compare HD74LS266FP-EL with alternatives